Beamforming communication systems with power amplifier output impedance tuning control

ABSTRACT

Apparatus and methods for beamforming communication systems with power control based on antenna pattern configuration are provided. In certain embodiments, a beamforming communication system includes an antenna array including a plurality of antenna elements. The beamforming communication system further includes a plurality of signal conditioning circuits operatively associated with the antenna elements, and an antenna array management circuit that generates a plurality of control signals that individually control the signal conditioning circuits. The antenna array management circuit achieves a desired level of power control based on generating the control signals to select an antenna pattern configuration associated with a desired power control level.

CROSS-REFERENCE TO RELATED APPLICATIONS

Any and all applications for which a foreign or domestic priority claimis identified in the Application Data Sheet, or any correction thereto,are hereby incorporated by reference under 37 CFR 1.57.

BACKGROUND Technical Field

Embodiments of the invention relate to electronic systems, and inparticular, to radio frequency (RF) electronics.

Description of Related Technology

A communication system can include a transceiver, a front end, and oneor more antennas for wirelessly transmitting and/or receiving signals.The front end can include low noise amplifier(s) for amplifyingrelatively weak signals received via the antenna(s), and poweramplifier(s) for boosting signals for transmission via the antenna(s).

Examples of communication systems include, but are not limited to,mobile phones, tablets, base stations, network access points,customer-premises equipment (CPE), laptops, and wearable electronics.

SUMMARY

In certain embodiments, the present disclosure relates to a beamformingcommunication system. The beamforming communication system includes anantenna array including a plurality of antenna elements, a plurality ofsignal conditioning circuits each operatively associated with acorresponding one of the plurality of antenna elements, and an antennaarray management circuit configured to generate a plurality of controlsignals each operable to individually control a corresponding one of theplurality of signal conditioning circuits to operate the antenna arrayin a selected antenna pattern configuration. The selected antennapattern configuration is chosen from a plurality of antenna patternconfigurations providing different levels of power control.

In various embodiments, the plurality of control signals are eachoperable to set the corresponding signal conditioning circuit in an onstate or an off state.

In a number of embodiments, the plurality of control signals are eachoperable to set the corresponding signal conditioning circuit in an onstate, an off state, or an attenuated state, the attenuated stateproviding a portion of the gain provided by the on state.

In several embodiments, the antenna array is a dual polarization antennaarray, and the selected antenna pattern configuration provides powercontrol for at least one antenna polarization.

In various embodiments, the selected antenna pattern configurationprovides a coarse power control adjustment. In accordance with a numberof embodiments, the selected antenna pattern configuration includes oneor more active antenna elements, and the antenna array managementcircuit is further configured to provide a fine power control adjustmentby setting a signal path gain of each of the one or more active antennaelements.

In some embodiments, the antenna array is configured for wirelesstransmission, and the plurality of antenna pattern configurationsprovide different steps of effective isotropic radiated power.

In a number of embodiments, the antenna array is configured for wirelessreception, and the plurality of antenna pattern configurations providedifferent values of effective isotropic sensitivity.

In several embodiments, the beamforming communication system furtherincludes a plurality of antenna termination circuits each connected to acorresponding one of the plurality of antenna elements, and the antennaarray management circuit is further configured to control the pluralityof antenna termination circuits based on the selected antenna patternconfiguration. According to various embodiments, the selected antennapattern configuration includes one or more inactive antenna elements,and the antenna array management circuit is further configured toterminate each of the one or more inactive antenna elements using thecorresponding one of the plurality of antenna termination circuits.

In some embodiments, the beamforming communication system furtherincludes a front end integrated circuit including at least one front endcomponent connected along a signal path to the antenna array, and amemory circuit programmed with data operable to control one or moresettings of the at least one front end component. According to a numberof embodiments, the data of the memory circuit provides compensation forelectromagnetic coupling associated with the selected antenna patternconfiguration.

In various embodiments, each of the plurality of signal conditioningcircuits includes a power amplifier, and the beamforming communicationsystem further includes a power amplifier output tuning control circuitconfigured to tune an output impedance of each power amplifier based onthe selected antenna pattern configuration.

In several embodiments, each of the plurality of signal conditioningcircuits includes a low noise amplifier, and the beamformingcommunication system further includes a low noise amplifier input tuningcontrol circuit configured to tune an input impedance of each low noiseamplifier based on the selected antenna pattern configuration.

In certain embodiments, the present disclosure relates to a radiofrequency module for a beamforming communication system. The radiofrequency module includes a substrate, an antenna array attached to thesubstrate and including a plurality of antenna elements, and asemiconductor die attached to the substrate and including a plurality ofsignal conditioning circuits each operatively associated with acorresponding one of the plurality of antenna elements. Thesemiconductor die further includes an antenna array management circuitconfigured to generate a plurality of control signals each operable toindividually control a corresponding one of the plurality of signalconditioning circuits to operate the antenna array in a selected antennapattern configuration. The selected antenna pattern configuration ischosen from a plurality of antenna pattern configurations providingdifferent levels of power control.

In some embodiments, the plurality of control signals are each operableto set the corresponding signal conditioning circuit in an on state oran off state.

In several embodiments, the plurality of control signals are eachoperable to set the corresponding signal conditioning circuit in an onstate, an off state, or an attenuated state, the attenuated stateproviding a portion of the gain provided by the on state.

In a number of embodiments, the antenna array is a dual polarizationantenna array, and the selected antenna pattern configuration providespower control for at least one antenna polarization.

In some embodiments, the selected antenna pattern configuration providesa coarse power control adjustment. According to various embodiments, theselected antenna pattern configuration includes one or more activeantenna elements, and the antenna array management circuit is furtherconfigured to provide a fine power control adjustment by setting asignal path gain of each of the one or more active antenna elements.

In several embodiments, the antenna array is configured for wirelesstransmission, and the plurality of antenna pattern configurationsprovide different steps of effective isotropic radiated power.

In a number of embodiments, the antenna array is configured for wirelessreception, and the plurality of antenna pattern configurations providedifferent values of effective isotropic sensitivity.

In various embodiments, the semiconductor die further includes aplurality of antenna termination circuits each connected to acorresponding one of the plurality of antenna elements, and the antennaarray management circuit is further configured to control the pluralityof antenna termination circuits based on the selected antenna patternconfiguration. According to several embodiments, the selected antennapattern configuration includes one or more inactive antenna elementschosen from the plurality of antenna elements, and the antenna arraymanagement circuit is further configured to terminate each of the one ormore inactive antenna elements using the corresponding one of theplurality of antenna termination circuits.

In some embodiments, the semiconductor die further includes at least onefront end component connected along a signal path to the antenna array,and a memory circuit programmed with data operable to control one ormore settings of the at least one front end component. According to anumber of embodiments, the data of the memory circuit providescompensation for electromagnetic coupling associated with the selectedantenna pattern configuration.

In various embodiments, each of the plurality of signal conditioningcircuits includes a power amplifier, and the semiconductor die furtherincludes a power amplifier output tuning control circuit configured totune an output impedance of each power amplifier based on the selectedantenna pattern configuration.

In several embodiments, each of the plurality of signal conditioningcircuits includes a low noise amplifier, and the semiconductor diefurther includes a low noise amplifier input tuning control circuitconfigured to tune an input impedance of each low noise amplifier basedon the selected antenna pattern configuration.

In certain embodiments, the present disclosure relates to a method ofpower control in a beamforming communication system. The method includesselecting an antenna pattern configuration from a plurality of availableantenna pattern configurations providing different levels of powercontrol, generating a plurality of control signals based on the selectedantenna pattern configuration using an antenna array management circuit,and operating an array of antenna elements in the selected antennapattern configuration by controlling a plurality of signal conditioningcircuits with the plurality of control signals, each of the plurality ofsignal conditioning circuits coupled to a corresponding antenna elementof the array.

In some embodiments, controlling the plurality of signal conditioningcircuits with the plurality of control signals includes individuallysetting each signal conditioning circuit in an on state or an off state.

In several embodiments, controlling the plurality of signal conditioningcircuits with the plurality of control signals includes individuallysetting each signal conditioning circuit in an on state, an off state,or an attenuated state, the attenuated state providing a portion of thegain provided by the on state.

In a number of embodiments, the method further includes providing acoarse power control adjustment using the selected antenna patternconfiguration. According to various embodiments, the selected antennapattern configuration includes one or more active antenna elementschosen from the array of antenna elements, and the method furtherincludes providing a fine power control adjustment by setting a signalpath gain of each of the one or more active antenna elements.

In some embodiments, selecting the antenna pattern configurationincludes choosing the antenna pattern configuration to achieve a targeteffective isotropic radiated power, and the method further includestransmitting a signal using the array.

In several embodiments, selecting the antenna pattern configurationincludes choosing the antenna pattern configuration to achieve a targeteffective isotropic sensitivity, and the method further includesreceiving a signal using the array.

In various embodiments, the method further includes controlling aplurality of antenna termination circuits based on the selected antennapattern configuration, each of the plurality of antenna terminationcircuits connected to a corresponding antenna element of the array.According to a number of embodiments, the selected antenna patternconfiguration includes one or more inactive antenna elements chosen fromthe array of antenna elements, and the method further includesterminating each of the one or more inactive antenna elements using thecorresponding one of the plurality of antenna termination circuits.

In some embodiments, method further includes controlling at least onefront end component connected along a signal path to the array usingdata in a memory circuit, and compensating for electromagnetic couplingassociated with the selected antenna pattern configuration using thedata.

In a number of embodiments, each of the plurality of signal conditioningcircuits includes a power amplifier, and the method further includestuning an output impedance of each power amplifier based on the selectedantenna pattern configuration.

In several embodiments, each of the plurality of signal conditioningcircuits includes a low noise amplifier, and the method further includestuning an input impedance of each low noise amplifier based on theselected antenna pattern configuration.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of this disclosure will now be described, by way ofnon-limiting example, with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of one example of a communication network.

FIG. 2A is a schematic diagram of one example of a communication linkusing carrier aggregation.

FIG. 2B illustrates various examples of uplink carrier aggregation forthe communication link of FIG. 2A.

FIG. 2C illustrates various examples of downlink carrier aggregation forthe communication link of FIG. 2A.

FIG. 3A is a schematic diagram of one example of a downlink channelusing multi-input and multi-output (MIMO) communications.

FIG. 3B is schematic diagram of one example of an uplink channel usingMIMO communications.

FIG. 3C is schematic diagram of another example of an uplink channelusing MIMO communications.

FIG. 4A is a schematic diagram of one embodiment of a radio frequency(RF) system with antenna array management to provide power control.

FIG. 4B is a schematic diagram of another embodiment of an RF systemwith antenna array management to provide power control.

FIG. 5A is a schematic diagram of another embodiment of an RF systemwith antenna array management to provide power control.

FIG. 5B is a schematic diagram of one example of beamforming to providea transmit beam.

FIG. 5C is a schematic diagram of one example of beamforming to providea receive beam.

FIG. 6 is a schematic diagram of another embodiment of an RF system withantenna array management to provide power control.

FIG. 7A is a schematic diagram of another embodiment of an RF systemwith antenna array management to provide power control.

FIG. 7B is a schematic diagram of another embodiment of an RF systemwith antenna array management to provide power control.

FIG. 8 is a schematic diagram of one embodiment of power control basedon antenna pattern configuration.

FIG. 9 is a schematic diagram of another embodiment of power controlbased on antenna pattern configuration.

FIG. 10A is a schematic diagram of an RF system with antenna arraymanagement to provide power control and with antenna termination basedon antenna pattern configuration according to one embodiment.

FIG. 10B is a schematic diagram of a front end integrated circuitaccording to one embodiment.

FIG. 11A is a schematic diagram of an RF system with antenna arraymanagement to provide power control and with power amplifier outputtuning compensation according to one embodiment.

FIG. 11B is a schematic diagram of an RF system with antenna arraymanagement to provide power control and with low noise amplifier inputtuning compensation according to one embodiment.

FIG. 12A is graph of simulated beam pattern of a four by four (4×4)array of antenna elements for one scan angle for one example of anantenna pattern configuration with sixteen active antenna elements.

FIG. 12B is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with fourteen active antenna elements.

FIG. 12C is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with twelve active antenna elements.

FIG. 12D is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with twelve active antenna elements.

FIG. 12E is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with ten active antenna elements.

FIG. 12F is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with nine active antenna elements.

FIG. 12G is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12H is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12I is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12J is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12K is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with seven active antenna elements.

FIG. 12L is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with six active antenna elements.

FIG. 12M is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with six active antenna elements.

FIG. 12N is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with five active antenna elements.

FIG. 12O is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with four active antenna elements.

FIG. 12P is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with three active antenna elements.

FIG. 12Q is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with two active antenna elements.

FIG. 12R is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with one active antenna elements.

FIG. 13A is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with sixteen active antenna elements.

FIG. 13B is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with fourteen active antenna elements.

FIG. 13C is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with twelve active antenna elements.

FIG. 13D is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with twelve active antenna elements.

FIG. 13E is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with ten active antenna elements.

FIG. 13F is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with nine active antenna elements.

FIG. 13G is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with eight active antenna elements.

FIG. 13H is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with eight active antenna elements.

FIG. 13I is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with eight active antenna elements.

FIG. 13J is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with eight active antenna elements.

FIG. 13K is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with seven active antenna elements.

FIG. 13L is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with six active antenna elements.

FIG. 13M is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with six active antenna elements.

FIG. 13N is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with five active antenna elements.

FIG. 13O is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with four active antenna elements.

FIG. 13P is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with three active antenna elements.

FIG. 13Q is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with two active antenna elements.

FIG. 13R is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with one active antenna elements.

FIG. 14 is a schematic diagram of one embodiment of a module.

FIG. 15A is a perspective view of another embodiment of a module.

FIG. 15B is a cross-section of the module of FIG. 15A taken along thelines 15B-15B.

FIG. 16 is a schematic diagram of one embodiment of a mobile device.

FIG. 17A is a schematic diagram of another embodiment of a module.

FIG. 17B is a schematic diagram of a cross-section of the module of FIG.17A taken along the lines 17B-17B.

FIG. 18A is a schematic diagram of a cross-section of another embodimentof a module.

FIG. 18B is a perspective view of another embodiment of a module.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

The following detailed description of certain embodiments presentsvarious descriptions of specific embodiments. However, the innovationsdescribed herein can be embodied in a multitude of different ways, forexample, as defined and covered by the claims. In this description,reference is made to the drawings where like reference numerals canindicate identical or functionally similar elements. It will beunderstood that elements illustrated in the figures are not necessarilydrawn to scale. Moreover, it will be understood that certain embodimentscan include more elements than illustrated in a drawing and/or a subsetof the elements illustrated in a drawing. Further, some embodiments canincorporate any suitable combination of features from two or moredrawings.

The International Telecommunication Union (ITU) is a specialized agencyof the United Nations (UN) responsible for global issues concerninginformation and communication technologies, including the shared globaluse of radio spectrum.

The 3rd Generation Partnership Project (3GPP) is a collaboration betweengroups of telecommunications standard bodies across the world, such asthe Association of Radio Industries and Businesses (ARIB), theTelecommunications Technology Committee (TTC), the China CommunicationsStandards Association (CCSA), the Alliance for TelecommunicationsIndustry Solutions (ATIS), the Telecommunications Technology Association(TTA), the European Telecommunications Standards Institute (ETSI), andthe Telecommunications Standards Development Society, India (TSDSI).

Working within the scope of the ITU, 3GPP develops and maintainstechnical specifications for a variety of mobile communicationtechnologies, including, for example, second generation (2G) technology(for instance, Global System for Mobile Communications (GSM) andEnhanced Data Rates for GSM Evolution (EDGE)), third generation (3G)technology (for instance, Universal Mobile Telecommunications System(UMTS) and High Speed Packet Access (HSPA)), and fourth generation (4G)technology (for instance, Long Term Evolution (LTE) and LTE-Advanced).

The technical specifications controlled by 3GPP can be expanded andrevised by specification releases, which can span multiple years andspecify a breadth of new features and evolutions.

In one example, 3GPP introduced carrier aggregation (CA) for LTE inRelease 10. Although initially introduced with two downlink carriers,3GPP expanded carrier aggregation in Release 14 to include up to fivedownlink carriers and up to three uplink carriers. Other examples of newfeatures and evolutions provided by 3GPP releases include, but are notlimited to, License Assisted Access (LAA), enhanced LAA (eLAA),Narrowband Internet of things (NB-IOT), Vehicle-to-Everything (V2×), andHigh Power User Equipment (HPUE).

3GPP introduced Phase 1 of fifth generation (5G) technology in Release15, and plans to introduce Phase 2 of 5G technology in Release 16(targeted for 2019). Subsequent 3GPP releases will further evolve andexpand 5G technology. 5G technology is also referred to herein as 5G NewRadio (NR).

5G NR supports or plans to support a variety of features, such ascommunications over millimeter wave spectrum, beamforming capability,high spectral efficiency waveforms, low latency communications, multipleradio numerology, and/or non-orthogonal multiple access (NOMA). Althoughsuch RF functionalities offer flexibility to networks and enhance userdata rates, supporting such features can pose a number of technicalchallenges.

The teachings herein are applicable to a wide variety of communicationsystems, including, but not limited to, communication systems usingadvanced cellular technologies, such as LTE-Advanced, LTE-Advanced Pro,and/or 5G NR.

FIG. 1 is a schematic diagram of one example of a communication network10. The communication network 10 includes a macro cell base station 1, asmall cell base station 3, and various examples of user equipment (UE),including a first mobile device 2 a, a wireless-connected car 2 b, alaptop 2 c, a stationary wireless device 2 d, a wireless-connected train2 e, a second mobile device 2 f, and a third mobile device 2 g.

Although specific examples of base stations and user equipment areillustrated in FIG. 1, a communication network can include base stationsand user equipment of a wide variety of types and/or numbers.

For instance, in the example shown, the communication network 10includes the macro cell base station 1 and the small cell base station3. The small cell base station 3 can operate with relatively lowerpower, shorter range, and/or with fewer concurrent users relative to themacro cell base station 1. The small cell base station 3 can also bereferred to as a femtocell, a picocell, or a microcell. Although thecommunication network 10 is illustrated as including two base stations,the communication network 10 can be implemented to include more or fewerbase stations and/or base stations of other types.

Although various examples of user equipment are shown, the teachingsherein are applicable to a wide variety of user equipment, including,but not limited to, mobile phones, tablets, laptops, IoT devices,wearable electronics, customer premises equipment (CPE),wireless-connected vehicles, wireless relays, and/or a wide variety ofother communication devices. Furthermore, user equipment includes notonly currently available communication devices that operate in acellular network, but also subsequently developed communication devicesthat will be readily implementable with the inventive systems,processes, methods, and devices as described and claimed herein.

The illustrated communication network 10 of FIG. 1 supportscommunications using a variety of cellular technologies, including, forexample, 4G LTE and 5G NR. In certain implementations, the communicationnetwork 10 is further adapted to provide a wireless local area network(WLAN), such as WiFi. Although various examples of communicationtechnologies have been provided, the communication network 10 can beadapted to support a wide variety of communication technologies.

Various communication links of the communication network 10 have beendepicted in FIG. 1. The communication links can be duplexed in a widevariety of ways, including, for example, using frequency-divisionduplexing (FDD) and/or time-division duplexing (TDD). FDD is a type ofradio frequency communications that uses different frequencies fortransmitting and receiving signals. FDD can provide a number ofadvantages, such as high data rates and low latency. In contrast, TDD isa type of radio frequency communications that uses about the samefrequency for transmitting and receiving signals, and in which transmitand receive communications are switched in time. TDD can provide anumber of advantages, such as efficient use of spectrum and variableallocation of throughput between transmit and receive directions.

In certain implementations, user equipment can communicate with a basestation using one or more of 4G LTE, 5G NR, and WiFi technologies. Incertain implementations, enhanced license assisted access (eLAA) is usedto aggregate one or more licensed frequency carriers (for instance,licensed 4G LTE and/or 5G NR frequencies), with one or more unlicensedcarriers (for instance, unlicensed WiFi frequencies).

As shown in FIG. 1, the communication links include not onlycommunication links between UE and base stations, but also UE to UEcommunications and base station to base station communications. Forexample, the communication network 10 can be implemented to supportself-fronthaul and/or self-backhaul (for instance, as between mobiledevice 2 g and mobile device 2 f).

The communication links can operate over a wide variety of frequencies.In certain implementations, communications are supported using 5G NRtechnology over one or more frequency bands that are less than 6Gigahertz (GHz) and/or over one or more frequency bands that are greaterthan 6 GHz. For example, the communication links can serve FrequencyRange 1 (FR1), Frequency Range 2 (FR2), or a combination thereof. In oneembodiment, one or more of the mobile devices support a HPUE power classspecification.

In certain implementations, a base station and/or user equipmentcommunicates using beamforming. For example, beamforming can be used tofocus signal strength to overcome path losses, such as high lossassociated with communicating over high signal frequencies. In certainembodiments, user equipment, such as one or more mobile phones,communicate using beamforming on millimeter wave frequency bands in therange of 30 GHz to 300 GHz and/or upper centimeter wave frequencies inthe range of 6 GHz to 30 GHz, or more particularly, 24 GHz to 30 GHz.

Different users of the communication network 10 can share availablenetwork resources, such as available frequency spectrum, in a widevariety of ways.

In one example, frequency division multiple access (FDMA) is used todivide a frequency band into multiple frequency carriers. Additionally,one or more carriers are allocated to a particular user. Examples ofFDMA include, but are not limited to, single carrier FDMA (SC-FDMA) andorthogonal FDMA (OFDMA). OFDMA is a multicarrier technology thatsubdivides the available bandwidth into multiple mutually orthogonalnarrowband subcarriers, which can be separately assigned to differentusers.

Other examples of shared access include, but are not limited to, timedivision multiple access (TDMA) in which a user is allocated particulartime slots for using a frequency resource, code division multiple access(CDMA) in which a frequency resource is shared amongst different usersby assigning each user a unique code, space-divisional multiple access(SDMA) in which beamforming is used to provide shared access by spatialdivision, and non-orthogonal multiple access (NOMA) in which the powerdomain is used for multiple access. For example, NOMA can be used toserve multiple users at the same frequency, time, and/or code, but withdifferent power levels.

Enhanced mobile broadband (eMBB) refers to technology for growing systemcapacity of LTE networks. For example, eMBB can refer to communicationswith a peak data rate of at least 10 Gbps and a minimum of 100 Mbps foreach user. Ultra-reliable low latency communications (uRLLC) refers totechnology for communication with very low latency, for instance, lessthan 2 milliseconds. uRLLC can be used for mission-criticalcommunications such as for autonomous driving and/or remote surgeryapplications. Massive machine-type communications (mMTC) refers to lowcost and low data rate communications associated with wirelessconnections to everyday objects, such as those associated with Internetof Things (IoT) applications.

The communication network 10 of FIG. 1 can be used to support a widevariety of advanced communication features, including, but not limitedto, eMBB, uRLLC, and/or mMTC.

FIG. 2A is a schematic diagram of one example of a communication linkusing carrier aggregation. Carrier aggregation can be used to widenbandwidth of the communication link by supporting communications overmultiple frequency carriers, thereby increasing user data rates andenhancing network capacity by utilizing fragmented spectrum allocations.

In the illustrated example, the communication link is provided between abase station 21 and a mobile device 22. As shown in FIG. 2A, thecommunications link includes a downlink channel used for RFcommunications from the base station 21 to the mobile device 22, and anuplink channel used for RF communications from the mobile device 22 tothe base station 21.

Although FIG. 2A illustrates carrier aggregation in the context of FDDcommunications, carrier aggregation can also be used for TDDcommunications.

In certain implementations, a communication link can provideasymmetrical data rates for a downlink channel and an uplink channel.For example, a communication link can be used to support a relativelyhigh downlink data rate to enable high speed streaming of multimediacontent to a mobile device, while providing a relatively slower datarate for uploading data from the mobile device to the cloud.

In the illustrated example, the base station 21 and the mobile device 22communicate via carrier aggregation, which can be used to selectivelyincrease bandwidth of the communication link. Carrier aggregationincludes contiguous aggregation, in which contiguous carriers within thesame operating frequency band are aggregated. Carrier aggregation canalso be non-contiguous, and can include carriers separated in frequencywithin a common band or in different bands.

In the example shown in FIG. 2A, the uplink channel includes threeaggregated component carriers f_(UL1), f_(UL2), and f_(UL3).Additionally, the downlink channel includes five aggregated componentcarriers f_(DL1), f_(DL2), f_(DL3), f_(DL4), and f_(DL5). Although oneexample of component carrier aggregation is shown, more or fewercarriers can be aggregated for uplink and/or downlink. Moreover, anumber of aggregated carriers can be varied over time to achieve desireduplink and downlink data rates.

For example, a number of aggregated carriers for uplink and/or downlinkcommunications with respect to a particular mobile device can changeover time. For example, the number of aggregated carriers can change asthe device moves through the communication network and/or as networkusage changes over time.

FIG. 2B illustrates various examples of uplink carrier aggregation forthe communication link of FIG. 2A. FIG. 2B includes a first carrieraggregation scenario 31, a second carrier aggregation scenario 32, and athird carrier aggregation scenario 33, which schematically depict threetypes of carrier aggregation.

The carrier aggregation scenarios 31-33 illustrate different spectrumallocations for a first component carrier f_(UL1), a second componentcarrier f_(UL2), and a third component carrier f_(UL3). Although FIG. 2Bis illustrated in the context of aggregating three component carriers,carrier aggregation can be used to aggregate more or fewer carriers.Moreover, although illustrated in the context of uplink, the aggregationscenarios are also applicable to downlink.

The first carrier aggregation scenario 31 illustrates intra-bandcontiguous carrier aggregation, in which component carriers that areadjacent in frequency and in a common frequency band are aggregated. Forexample, the first carrier aggregation scenario 31 depicts aggregationof component carriers f_(UL1), f_(UL2), and f_(UL3) that are contiguousand located within a first frequency band BAND1.

With continuing reference to FIG. 2B, the second carrier aggregationscenario 32 illustrates intra-band non-continuous carrier aggregation,in which two or more components carriers that are non-adjacent infrequency and within a common frequency band are aggregated. Forexample, the second carrier aggregation scenario 32 depicts aggregationof component carriers f_(UL1), f_(UL2), and f_(UL3) that arenon-contiguous, but located within a first frequency band BAND1.

The third carrier aggregation scenario 33 illustrates inter-bandnon-contiguous carrier aggregation, in which component carriers that arenon-adjacent in frequency and in multiple frequency bands areaggregated. For example, the third carrier aggregation scenario 33depicts aggregation of component carriers f_(UL1) and f_(UL2) of a firstfrequency band BAND1 with component carrier f_(UL3) of a secondfrequency band BAND2.

FIG. 2C illustrates various examples of downlink carrier aggregation forthe communication link of FIG. 2A. The examples depict various carrieraggregation scenarios 34-38 for different spectrum allocations of afirst component carrier f_(DL1), a second component carrier f_(DL2), athird component carrier f_(DL3), a fourth component carrier f_(DL4), anda fifth component carrier f_(DL5). Although FIG. 2C is illustrated inthe context of aggregating five component carriers, carrier aggregationcan be used to aggregate more or fewer carriers. Moreover, althoughillustrated in the context of downlink, the aggregation scenarios arealso applicable to uplink.

The first carrier aggregation scenario 34 depicts aggregation ofcomponent carriers that are contiguous and located within the samefrequency band. Additionally, the second carrier aggregation scenario 35and the third carrier aggregation scenario 36 illustrates two examplesof aggregation that are non-contiguous, but located within the samefrequency band. Furthermore, the fourth carrier aggregation scenario 37and the fifth carrier aggregation scenario 38 illustrates two examplesof aggregation in which component carriers that are non-adjacent infrequency and in multiple frequency bands are aggregated. As a number ofaggregated component carriers increases, a complexity of possiblecarrier aggregation scenarios also increases.

With reference to FIGS. 2A-2C, the individual component carriers used incarrier aggregation can be of a variety of frequencies, including, forexample, frequency carriers in the same band or in multiple bands.Additionally, carrier aggregation is applicable to implementations inwhich the individual component carriers are of about the same bandwidthas well as to implementations in which the individual component carriershave different bandwidths.

Certain communication networks allocate a particular user device with aprimary component carrier (PCC) or anchor carrier for uplink and a PCCfor downlink. Additionally, when the mobile device communicates using asingle frequency carrier for uplink or downlink, the user devicecommunicates using the PCC. To enhance bandwidth for uplinkcommunications, the uplink PCC can be aggregated with one or more uplinksecondary component carriers (SCCs). Additionally, to enhance bandwidthfor downlink communications, the downlink PCC can be aggregated with oneor more downlink SCCs.

In certain implementations, a communication network provides a networkcell for each component carrier. Additionally, a primary cell canoperate using a PCC, while a secondary cell can operate using a SCC. Theprimary and second cells may have different coverage areas, forinstance, due to differences in frequencies of carriers and/or networkenvironment.

License assisted access (LAA) refers to downlink carrier aggregation inwhich a licensed frequency carrier associated with a mobile operator isaggregated with a frequency carrier in unlicensed spectrum, such asWiFi. LAA employs a downlink PCC in the licensed spectrum that carriescontrol and signaling information associated with the communicationlink, while unlicensed spectrum is aggregated for wider downlinkbandwidth when available. LAA can operate with dynamic adjustment ofsecondary carriers to avoid WiFi users and/or to coexist with WiFiusers. Enhanced license assisted access (eLAA) refers to an evolution ofLAA that aggregates licensed and unlicensed spectrum for both downlinkand uplink.

FIG. 3A is a schematic diagram of one example of a downlink channelusing multi-input and multi-output (MIMO) communications. FIG. 3B isschematic diagram of one example of an uplink channel using MIMOcommunications.

MIMO communications use multiple antennas for simultaneouslycommunicating multiple data streams over common frequency spectrum. Incertain implementations, the data streams operate with differentreference signals to enhance data reception at the receiver. MIMOcommunications benefit from higher SNR, improved coding, and/or reducedsignal interference due to spatial multiplexing differences of the radioenvironment.

MIMO order refers to a number of separate data streams sent or received.For instance, MIMO order for downlink communications can be described bya number of transmit antennas of a base station and a number of receiveantennas for UE, such as a mobile device. For example, two-by-two (2×2)DL MIMO refers to MIMO downlink communications using two base stationantennas and two UE antennas. Additionally, four-by-four (4×4) DL MIMOrefers to MIMO downlink communications using four base station antennasand four UE antennas.

In the example shown in FIG. 3A, downlink MIMO communications areprovided by transmitting using M antennas 43 a, 43 b, 43 c, . . . 43 mof the base station 41 and receiving using N antennas 44 a, 44 b, 44 c,. . . 44 n of the mobile device 42. Accordingly, FIG. 3A illustrates anexample of m×n DL MIMO.

Likewise, MIMO order for uplink communications can be described by anumber of transmit antennas of UE, such as a mobile device, and a numberof receive antennas of a base station. For example, 2×2 UL MIMO refersto MIMO uplink communications using two UE antennas and two base stationantennas. Additionally, 4×4 UL MIMO refers to MIMO uplink communicationsusing four UE antennas and four base station antennas.

In the example shown in FIG. 3B, uplink MIMO communications are providedby transmitting using N antennas 44 a, 44 b, 44 c, . . . 44 n of themobile device 42 and receiving using M antennas 43 a, 43 b, 43 c, . . .43 m of the base station 41. Accordingly, FIG. 3B illustrates an exampleof n×m UL MIMO.

By increasing the level or order of MIMO, bandwidth of an uplink channeland/or a downlink channel can be increased.

MIMO communications are applicable to communication links of a varietyof types, such as FDD communication links and TDD communication links.

FIG. 3C is schematic diagram of another example of an uplink channelusing MIMO communications. In the example shown in FIG. 3C, uplink MIMOcommunications are provided by transmitting using N antennas 44 a, 44 b,44 c, . . . 44 n of the mobile device 42. Additional a first portion ofthe uplink transmissions are received using M antennas 43 a 1, 43 b 1,43 c 1, . . . 43 m 1 of a first base station 41 a, while a secondportion of the uplink transmissions are received using M antennas 43 a2, 43 b 2, 43 c 2, . . . 43 m 2 of a second base station 41 b.Additionally, the first base station 41 a and the second base station 41b communication with one another over wired, optical, and/or wirelesslinks.

The MIMO scenario of FIG. 3C illustrates an example in which multiplebase stations cooperate to facilitate MIMO communications.

Examples of Power Control Based on Antenna Pattern Configuration

Antenna arrays can be used in a wide variety of applications. Forinstance, antenna arrays can be used to transmit and/or receive radiofrequency (RF) signals in base stations, network access points, mobilephones, tablets, customer-premises equipment (CPE), laptops, computers,wearable electronics, and/or other communication devices.

Communication devices that utilize millimeter wave carriers (forinstance, 30 GHz to 300 GHz), centimeter wave carriers (for instance, 3GHz to 30 GHz), and/or other carrier frequencies can employ an antennaarray to provide beam formation and directivity for transmission and/orreception of signals.

For example, in the context of signal transmission, the signals from theantenna elements of the antenna array combine using constructive anddestructive interference to generate an aggregate transmit signalexhibiting beam-like qualities with more signal strength propagating ina given direction away from the antenna array. In the context of signalreception, more signal energy is received by the antenna array when thesignal is arriving from a particular direction. Accordingly, an antennaarray can also provide directivity for reception of signals.

A signal conditioning circuit can be used to condition a transmit signalfor transmission via an antenna element and/or to condition a receivedsignal from the antenna element. In one example, a signal conditioningcircuit includes a power amplifier that amplifies the transmit signalfor transmission, and a low noise amplifier (LNA) that amplifies thereceived signal for further processing while introducing a relativelysmall amount of noise. Such amplifiers can include variable gain stagesfor providing gain control and/or the signal conditioning circuit caninclude other gain control circuitry. In certain implementations, thesignal conditioning circuit further includes a phase shifter forproviding phase control. The signal conditioning circuits of acommunication device consume power when activated.

The power level of a beamforming communication system can change overtime to achieve desired operating characteristics. For example, atransmit power level and/or a receive power level of the beamformingcommunication system can be selected to achieve a desired trade-offbetween power consumption and communication range/rate for a givenoperating environment.

Apparatus and methods for beamforming communication systems with powercontrol based on antenna pattern configuration are provided. In certainembodiments, a beamforming communication system includes an antennaarray including a plurality of antenna elements. The beamformingcommunication system further includes a plurality of signal conditioningcircuits operatively associated with the antenna elements, and anantenna array management circuit that generates a plurality of controlsignals that individually control the signal conditioning circuits. Theantenna array management circuit achieves a desired level of powercontrol based on generating the control signals to select an antennapattern configuration associated with a desired power control level.

Accordingly, different patterns of active antenna elements of theantenna array can be used to provide different levels of power control.In the context of transmission, the antenna pattern configurations canprovide different transmit power levels, while in the context ofreception the antenna pattern configurations can provide differentreceive power levels. For example, the pattern of the antenna array canchange based on a setting for transmit power control (TPC) and/or asetting for automatic gain control (AGC).

Using an antenna pattern configuration for power control provides anumber of advantages relative to a beamforming communication system thatprovides power control by operating the signal path of each antennaelement with common gain or power settings. In particular, operatingfewer paths at full power can be more efficient than operating all pathsat reduced power.

For example, in the context of signal transmission, the power amplifiersof such a beamforming communication system can operate at an inefficientoperating point, for instance, a backed off power level. In contrast,certain beamforming communication systems herein disable a first portionof the total available power amplifiers while operating a second portionof the power amplifiers at an efficient operating point, for instance,at or near saturated power. Furthermore, when a signal conditioningcircuit for a particular antenna element is disabled, other circuitrysuch as phase-locked loops (PLLs) and/or mixers for providing frequencyconversion can also be disabled. Thus, providing power control viaantenna pattern configuration also provides energy savings.

In certain implementations, an antenna pattern configuration is achievedby turning on or off the signal conditioning circuit associated witheach antenna element. Thus, each signal conditioning circuit can becontrolled to an ON state or an OFF state to achieve the antenna patternconfiguration. In another example, each signal conditioning circuit canbe controlled to an ON state, an OFF state, or an attenuated state thatprovides a portion of the gain of the ON state. Including the attenuatedstate can aid in meeting power control accuracy and/or AGCspecifications.

Furthermore, in certain configurations power control can be provided toeach path in the ON state to provide finer grain power steps. In suchconfigurations, antenna pattern configuration provides coarse powercontrol while gain adjustment to the signal path provides fine powercontrol.

The teachings herein are applicable to antenna arrays that only transmitsignals, to antenna arrays that only receive signals, and to antennaarrays that both transmit signals and receive signals. In certainimplementations, the antenna array management circuit provides controlover up/down steps of effective isotropic radiated power (EIRP) tothereby provide transmit power control. In certain implementations, theantenna array management circuit controls receive power by providing anantenna pattern configuration that achieves a desired value of effectiveisotropic sensitivity (EIS), which can depend on received power and asignal-to-noise ratio (SNR) for demodulation. Both EIRP and EIS candepend on gain per path and beamforming gain.

In certain implementations, the antenna pattern configuration isselected to change antenna gain towards a base station, rather thanusing the same power control or AGC for every signal path to the antennaarray. In certain implementations, the antenna pattern configuration canalso be selected based on a wide variety of other factors, including butnot limited to, ability of a particular antenna pattern configuration toprovide controlled beam steering and/or to achieve a desired beam angle.

The selection of active, inactive, and/or attenuated antenna elementscan impact electromagnetic (EM) coupling between antenna elements. Thus,the load of each antenna element is dependent upon beam power and/ordirection. Accordingly, a selected antenna pattern configuration canimpact EM coupling between antenna elements. In various implementations,one or more components along one or more signal paths to the antennaarray are compensated for EM coupling associated with the selectedantenna pattern configuration.

In a first example, the termination of a deactivated antenna element iscontrolled based on the EM coupling associated with the selected antennapattern configuration.

In a second example, the termination of a power amplifier, a low noiseamplifier, a switch, or other component of an RF signal path iscompensated for EM coupling of the selected antenna patternconfiguration. For instance, output impedance tuning of a poweramplifier and/or input impedance tuning of a low noise amplifier can beprovided based on the selected antenna pattern configuration.

In a third example, a front end integrated circuit (IC) includes atleast one front end component (for example, one or more amplifiers,switches, phase shifters, and/or filters) and a memory circuit storingsettings (for instance, data indicating RF path parameters, such aspower, phase shift, etc.) of the component(s), which can vary for eachantenna element and/or for each beam of the array. Additionally, thesettings can be compensated for EM coupling associated with a particularantenna pattern configuration. Thus, a codebook stored in a memory unitcan reflect compensation for antenna pattern configuration.

In a fourth example, data associated with digital pre-distortion and/oranalog pre-distortion is compensated for impacts of EM coupling. Incertain implementations, such data is stored in a codebook stored of amemory unit.

Accordingly, one or more components along signal paths to an antennaarray can be controlled to compensate for EM coupling associated with aparticular antenna pattern configuration.

In certain implementations, power control is provided in steps (forinstance, steps of about 1 dB) over a range of at least 30 dB. Incertain implementations, selection of antenna pattern configuration iscombined with power control of each signal path or branch to cover therange of at least 30 dB with the desired power control step. Forexample, such signal path power control can include adjustments to theamount of gain and/or attenuation provided by various components alongthe signal path.

FIG. 4A is a schematic diagram of one embodiment of an RF system 110with antenna array management to provide power control. The RF system110 includes an antenna array 102 including antenna elements 103 a, 103b . . . 103 m. The RF system 110 further includes signal conditioningcircuits 104 a, 104 b . . . 104 m, and a transceiver 105 that includesan antenna array management circuit 106. Thus, the antenna arraymanagement circuit 106 is included in the transceiver 105, in thisembodiment. However, the antenna array management 106 circuit can be inany suitable location.

Although an embodiment with three antenna elements and correspondingsignal conditioning circuits is shown, an RF system can more or fewerantenna elements and/or signal conditioning circuits as indicated by theellipses.

In the illustrated embodiment, each of the signal conditioning circuits104 a, 104 b . . . 104 m is coupled to a corresponding one of theantenna elements 103 a, 103 b . . . 103 m. The signal conditioningcircuits 104 a, 104 b . . . 104 m can be used to condition signals fortransmission and/or reception via the antenna array 102.

Although an embodiment in which the conditioning circuits 104 a, 104 b .. . 104 m provide signal conditioning for both transmission andreception, other implementations are possible. For example, in certainimplementations, a communication device includes separate antenna arraysfor receiving signals and for transmitting signals. Thus, in certainimplementations, a signal conditioning circuit is used for transmitconditioning but not receive conditioning, or for receive conditioningbut not transmit conditioning.

As shown in FIG. 4A, the transceiver 105 generates control signals CTL₁,CTL₂ . . . CTL_(m) for individually controlling the signal conditioningcircuits 104 a, 104 b . . . 104 m, respectively. The control signalsCTL₁, CTL₂ . . . CTL_(m) are used to provide a desired antenna patternconfiguration, for instance, by enabling or disabling each of the signalconditioning circuits 104 a, 104 b . . . 104 m and/or by providing gainadjustment to one or more components therein.

By controlling the selected antenna pattern configuration, power controlis provided. Moreover, the antenna array management circuit 106 canchange the selected antenna pattern configuration over time based ondesired power control, thereby providing suitable performancecharacteristics at a given moment.

FIG. 4B is a schematic diagram of another embodiment of an RF system 120with antenna array management to provide power control. The RF system120 includes an antenna array 102, signal conditioning circuits 115 a,115 b . . . 115 m, and a transceiver 105.

The RF system 120 of FIG. 4B is similar to the RF system 110 of FIG. 4A,except that the RF system 120 includes a specific implementation ofsignal conditioning circuits controlled by enable signals EN₁, EN₂ . . .EN_(m). In particular, the signaling conditions circuits 115 a, 115 b .. . 115 m of FIG. 4B include power amplifiers 117 a, 117 b . . . 117 mand LNAs 118 a, 118 b . . . 118 m, respectively, which are selectivelyenabled by the antenna array management circuit 106.

Although FIG. 4B illustrates an implementation in which a poweramplifier and an LNA of a particular signal conditioning circuit receivea common enable signal, in certain implementations the antenna arraymanagement circuit 106 separately controls enabling/disabling of thepower amplifier and the low noise amplifier of a particular signalconditioning circuit.

Furthermore, although an example of signaling conditioning circuits withpower amplifiers and LNAs is shown, other implementations of signalingconditioning circuits are possible. For example, a signalingconditioning circuit can include other circuitry used to enable theintended RF communication channel between devices, including, but notlimited to, filters, attenuators, phase shifters, switches, and/or othercircuitry. Moreover, in certain implementations, a signalingconditioning circuit includes transmit conditioning circuitry (forinstance, a power amplifier) but not receive conditioning circuitry, orincludes receive conditioning circuitry (for instance, an LNA) but nottransmit conditioning circuitry.

FIG. 5A is a schematic diagram of another embodiment of an RF system 150with antenna array management to provide power control. The RF system150 includes an antenna array 132 including antenna elements 103 a 1,103 a 2 . . . 103 an, 103 b 1, 103 b 2 . . . 103 bn, 103 m 1, 103 m 2 .. . 103 mn. The RF system 150 further includes signal conditioningcircuits 104 a 1, 104 a 2 . . . 104 an, 104 b 1, 104 b 2 . . . 104 bn,104 m 1, 104 m 2 . . . 104 mn and a transceiver 145 that includes anantenna array management circuit 106. The antenna array managementcircuit 106 generates enable signals EN_(1,1), EN_(1,2) . . . EN_(1,n),EN_(2,1), EN_(2,2) . . . EN_(2,n), EN_(m,1), EN_(m,2) . . . EN_(m,n) forthe signal conditioning circuits 104 a 1, 104 a 2 . . . 104 an, 104 b 1,104 b 2 . . . 104 bn, 104 m 1, 104 m 2 . . . 104 mn, respectively.

The enable signals EN_(1,1), EN_(1,2) . . . EN_(1,n), EN_(2,1), EN_(2,2). . . EN_(2,n), EN_(m,1), EN_(m,2) . . . EN_(m,n) operate to select anantenna pattern configuration by enabling or disabling the signalconditioning circuits 104 a 1, 104 a 2 . . . 104 an, 104 b 1, 104 b 2 .. . 104 bn, 104 m 1, 104 m 2 . . . 104 mn. In another embodiment, theantenna array management circuit 106 also provides power control (forinstance, gain adjustment) to the signal conditioning circuits and/or tocomponents of the transceiver 145 associated with each signal path tothe antenna array 132. For example, in certain implementations, coarsepower control is provided by selecting the antenna patternconfiguration, while fine power control is provided via gain adjustmentto signal paths associated with active antenna elements.

The RF system 150 of FIG. 5A is similar to the RF system 110 of FIG. 4A,except that the RF system 150 illustrates a specific implementationusing an m×n antenna array 132 and corresponding signal conditioningcircuits, where m and n are integers greater than or equal to 1. Theproduct of m*n can vary depending on application. In one embodiment, m*nis in the range of 2 to 2048, or more particular, 16 to 256.

FIG. 5B is a schematic diagram of one example of beamforming to providea transmit beam. FIG. 5B illustrates a portion of a communication systemincluding a first signal conditioning circuit 144 a, a second signalconditioning circuit 144 b, a first antenna element 123 a, and a secondantenna element 123 b.

Although illustrated as including two antenna elements and two signalconditioning circuits, a communication system can include additionalantenna elements and/or signal conditioning circuits. For example, FIG.5B illustrates one embodiment of a portion of the communication system150 of FIG. 5A.

The first signal conditioning circuit 144 a includes a first poweramplifier 151 a, a first low noise amplifier (LNA) 152 a, a first phaseshifter 153 a, and switches for controlling selection of the poweramplifier 151 a or LNA 152 a. Additionally, the second signalconditioning circuit 144 b includes a second power amplifier 151 b, asecond LNA 152 b, a second phase shifter 153 b, and switches forcontrolling selection of the power amplifier 151 b or LNA 152 b.

Although one embodiment of signal conditioning circuits is shown, otherimplementations of signal conditioning circuits are possible. Forinstance, in one example, a signal conditioning circuit includes one ormore band filters, duplexers, and/or other components. Furthermore,although an implementation with an analog phase shifter is shown, theteachings herein are also applicable to implementations using digitalphase shifting (for instance, phase shifting using digital basebandprocessing) as well as to implementations using a combination of analogphase shifting and digital phase shifting.

In the illustrated embodiment, the first antenna element 123 a and thesecond antenna element 123 b are separated by a distance d.Additionally, FIG. 5B has been annotated with an angle Θ, which in thisexample has a value of about 90° when the transmit beam direction issubstantially perpendicular to a plane of the antenna array and a valueof about 0° when the transmit beam direction is substantially parallelto the plane of the antenna array.

By controlling the relative phase of the transmit signals provided tothe antenna elements 123 a, 123 b, a desired transmit beam angle Θ canbe achieved. For example, when the first phase shifter 153 a has areference value of 0°, the second phase shifter 153 b can be controlledto provide a phase shift of about −2⁻πf(d/v)cos Θ radians, where f isthe fundamental frequency of the transmit signal, d is the distancebetween the antenna elements, v is the velocity of the radiated wave,and π is the mathematic constant pi.

In certain implementations, the distance d is implemented to be about½λ, where λ is the wavelength of the fundamental component of thetransmit signal. In such implementations, the second phase shifter 153 bcan be controlled to provide a phase shift of about −π cos Θ radians toachieve a transmit beam angle Θ.

Accordingly, the relative phase of the phase shifters 153 a, 153 b canbe controlled to provide transmit beamforming. In certainimplementations, a transceiver (for example, the transceiver 145 of FIG.5A) controls phase values of one or more phase shifters to controlbeamforming. In certain implementations, an antenna array managementcircuit (for instance, the antenna array management circuit 106 of FIG.5A) controls the phase values of the one or more phase shifters.

FIG. 5C is a schematic diagram of one example of beamforming to providea receive beam. FIG. 5C is similar to FIG. 5B, except that FIG. 5Cillustrates beamforming in the context of a receive beam rather than atransmit beam.

As shown in FIG. 5C, a relative phase difference between the first phaseshifter 153 a and the second phase shifter 153 b can be selected toabout equal to −2πf(d/v)cos Θ radians to achieve a desired receive beamangle Θ. In implementations in which the distance d corresponds to about½λ, the phase difference can be selected to about equal to −π cos Θradians to achieve a receive beam angle Θ.

Although various equations for phase values to provide beamforming havebeen provided, other phase selection values are possible, such as phasevalues selected based on implementation of an antenna array,implementation of signal conditioning circuits, and/or a radioenvironment.

FIG. 6 is a schematic diagram of another embodiment of an RF system 160with antenna array management to provide power control. The RF system160 includes an antenna array 102, signal conditioning circuits 104 a,104 b . . . 104 m, signal generation circuits 156 a, 156 b . . . 156 m,and a baseband processor 157.

The RF system 160 of FIG. 6 is similar to the RF system 110 of FIG. 4A,except that the RF system 160 of FIG. 6 includes signal generationcircuits 156 a, 156 b . . . 156 m and a baseband processor 157 thatincludes an antenna array management circuit 158. Although shown asbeing included in the baseband processor 157, the antenna arraymanagement circuit 158 can be in any suitable location.

In the illustrated embodiment, the signal generation circuits 156 a, 156b . . . 156 m are coupled to corresponding signal conditioning circuits104 a, 104 b . . . 104 m, respectively. Accordingly, in this embodiment,signal generation circuits and signal conditioning circuits areone-to-one in ratio. However, other implementations are possible, suchas configurations in which a signal generation circuit is shared bymultiple signal conditioning circuits.

As shown in FIG. 6, the baseband processor 157 communicates digitalin-phase (I) and quadrature-phase (Q) signals with the signal generationcircuits 156 a, 156 b . . . 156 m. The antenna array management circuit158 generates enable signals EN₁, EN₂ . . . EN_(m) for enabling ordisabling the signal conditioning circuits 104 a, 104 b . . . 104 m toachieve a desired antenna pattern configuration. The antenna arraymanagement circuit 158 also generates signal generation gain controlsignals GC₁, GC₂ . . . GC_(m) for the signal generation circuits 156 a,156 b . . . 156 m, respectively. The signal generation gain controlsignals GC₁, GC₂ . . . GC_(m) can be used for selectively enablingand/or providing gain adjustment to the signal generation circuits 156a, 156 b . . . 156 m, respectively.

In certain implementations, the enable signals EN₁, EN₂ . . . EN_(m) areused to activate a pattern of antenna elements associated with aparticular antenna pattern configuration. Additionally, the signalgeneration gain control signals GC₁, GC₂ . . . GC_(m) are used toprovide gain control over the active antenna elements. Additionally oralternatively the signal generation gain control signals GC₁, GC₂ . . .GC_(m) are used to disable the signal generation circuits associatedwith deactivated antenna elements to thereby conserve power.

In one embodiment, the enable signals EN₁, EN₂ . . . EN_(m) select anantenna pattern configuration to provide coarse power control, while thesignal generation gain control signals GC₁, GC₂ . . . GC_(m) control again of the signal path of each active antenna element to provide finepower control.

FIG. 7A is a schematic diagram of another embodiment of an RF system 165with antenna array management to provide power control. The RF system165 includes signal conditioning circuits 161, an antenna array 162, andan antenna array management circuit 163.

The antenna array 162 is electrically connected to the signalconditioning circuits 161 along multiple RF signal paths or routes. Inone example, a corresponding RF signal path is included for each antennaelement of the antenna array 162.

In certain implementations, the RF system 165 further includes atransceiver, and the signal conditioning circuits 161 are included in afront end system interposed between the transceiver and the antennaarray 162.

As shown in FIG. 7A, the antenna array management circuit 163 providescontrol signals to the signal conditioning circuits 161. The controlsignals provide power control in accordance with the teachings herein.For example, the control signals can be used to control the signalconditioning circuits 161 to select an antenna pattern configuration ofthe antenna array 162 associated with a desired power control level.

FIG. 7B is a schematic diagram of another embodiment of an RF system 170with antenna array management to provide power control. The RF system170 includes signal conditioning circuits 161, a dual polarizationantenna array 172, and an antenna array management circuit 163.

The RF system 170 of FIG. 7B is similar to the RF system 165 of FIG. 7A,except that the RF system 170 is illustrated as including the dualpolarization antenna array 172. Thus, the signal conditioning circuits161 communicate using an antenna array with dual polarization, in thisexample.

In certain implementations, a common antenna pattern configuration isused for each polarization of the dual polarization antenna array 172.In other implementations, different antenna pattern configurations areused for each polarization of the dual polarization antenna array 172.

Any of the embodiments herein can be implemented with a dualpolarization antenna array.

FIG. 8 is a schematic diagram of one embodiment of power control basedon antenna pattern configuration. The diagram depicts eighteen antennapattern configurations for one implementation of a four by four (4×4)antenna array in which the selected antenna pattern configurationprovides power control. However, the teachings herein are applicable toother antenna pattern configurations as well as to other array sizes.

For each antenna pattern configuration, a type of fill is used tographically illustrate whether a particular antenna element is in anactivated or ON state or in a deactivated or OFF state. Furthermore, foreach antenna pattern configuration, the total number of active antennaelements (ON) and a total calculated amount of conducted power (DB) isindicated.

Although an example depicting conducted power is shown, in certainimplementations power control is provided in steps of EIRP or EIS. Forexample, different antenna pattern configurations with the sameconducted power can have different antenna gain and different amounts ofEIRP.

In certain implementations, gain control is also provided to the signalpath (for instance, controlling a gain or attenuation provided by one ormore components along the signal path) of each active antenna element toprovide finer grain power steps. Accordingly, in certain implementationsan antenna pattern configuration provides coarse power control while again or attenuation of the active signal paths is controlled to providefine power control.

FIG. 9 is a schematic diagram of another embodiment of power controlbased on antenna pattern configuration. The diagram depicts thirtyantenna pattern configurations for one implementation of a 4×4 antennaarray. However, the teachings herein are applicable to other antennapattern configurations as well as to other array sizes and/or shapes.

For each antenna pattern configuration, each antenna element isgraphically depicted with a fill to indicate whether the antenna elementis in an activated state, a deactivated state, or an attenuated state.Furthermore, each antenna pattern configuration indicates the totalnumber of active antenna elements (ON), the portion of power provided byan antenna element in an attenuated state relative to an on state (ATT),an equivalent number of fully on antenna elements (eq), and a totalamount of conducted power (DB). Although an example depicting conductedpower is shown, in certain implementations power control is provided insteps of EIRP or EIS.

FIG. 10A is a schematic diagram of an RF system 200 with antenna arraymanagement to provide power control and with antenna termination basedon antenna pattern configuration according to one embodiment. The RFsystem 200 includes an antenna array 201, signal conditioning circuits115 a, 115 b . . . 115 m, and a transceiver 202.

The RF system 200 of FIG. 10A is similar to the RF system 120 of FIG.4B, except that the antenna array 201 of the RF system 200 furtherincludes controllable antenna termination circuits 208 a, 208 b . . .208 m. Additionally, the transceiver 202 includes an antenna arraymanagement circuit 106 that generates tuning control signals T₁, T₂ . .. T_(m) for controlling the antenna termination provided by each of thecontrollable antenna termination circuits 208 a, 208 b . . . 208 m. Inone example, the termination provided can be open, short to ground, or aparticular impedance value to ground.

In certain implementations, the selection of active, inactive, and/orattenuated antenna elements impacts EM coupling between antennaelements. Thus, the load of each antenna element is dependent upon beampower and/or direction. Accordingly, a selected antenna patternconfiguration can impact EM coupling between antenna elements.

In the illustrated embodiment, the termination of a deactivated antennaelement is controlled based on the EM coupling associated with theselected antenna pattern configuration. Thus, the tuning control signalsT₁, T₂ . . . T_(m) change based on the state of the enable signals EN₁,EN₂ . . . EN_(m) used to select the antenna pattern configuration.Accordingly, compensation for EM coupling is provided.

FIG. 10B is a schematic diagram of a front end IC or semiconductor die250 according to one embodiment. The front end IC 250 includes at leastone front end component 251, a memory circuit 252 including a codebook253, and an interface 254.

One or more instantiations of the front end IC 250 can be included in anRF system to process signals of an antenna array. For example, the atleast one front end component 251 can include one or more components forhandling signals processed along one or more RF signal paths connectingto the antenna array. Examples of front end components include, but arenot limited to, amplifiers, phase shifters, and/or filters.

The memory circuit 252 includes a codebook 253, which stores settings ofthe at least one front end component 251, such as power, phase shift,and/or other parameters, which can change for each antenna elementand/or for each beam of the array. In the illustrated embodiment, thedata of the codebook 253 is compensated for EM coupling associated witha particular antenna pattern configuration. Thus, the codebook 253stored in the memory circuit 252 reflects compensation for antennapattern configuration. In certain implementations, the codebook 253further includes data for compensation digital pre-distortion and/oranalog pre-distortion for impacts of EM coupling.

The front end IC 250 further includes the interface 254, which can be,for example, a serial interface such as a MIPI RFFE bus. In certainimplementations, the codebook 253 is programmed in the memory circuit252 via the interface 254.

FIG. 11A is a schematic diagram of an RF system 500 with antenna arraymanagement to provide power control and with power amplifier outputtuning compensation according to one embodiment. The RF system 500includes an antenna array 102, signal conditioning circuits 115 a′, 115b′ . . . 115 m′, an antenna array management circuit 106, and a poweramplifier output tuning control circuit 107.

Although an embodiment with three antenna elements and correspondingsignal conditioning circuits is shown, an RF system can more or fewerantenna elements and/or signal conditioning circuits as indicated by theellipses.

In the embodiment shown in FIG. 11A, each of the signal conditioningcircuits includes a power amplifier and an LNA. For example, the signalconditioning circuit 115 a′ includes a power amplifier 117 a′ and an LNA118 a, the signal conditioning circuit 115 b′ includes a power amplifier117 b′ and an LNA 118 b, and the signal conditioning circuit 115 m′includes a power amplifier 117 m′ and an LNA 118 m.

Although an example of signal conditioning circuits with poweramplifiers and LNAs is shown, other implementations of signalconditioning circuits are possible. For example, a signal conditioningcircuit can include additional circuitry, including, for example,switches, phase shifters, duplexers, diplexers, and/or other components.

As shown in FIG. 11A, the antenna array management circuit 106 generatesenable signals EN₁, EN₂ . . . EN_(m) for individually enabling ordisabling the signal conditioning circuits 115 a′, 115 b′ . . . 115 m′,respectively. The antenna array management circuit 106 uses the enablesignals EN₁, EN₂ . . . EN_(m) to provide a particular antenna patternconfiguration of the antenna array 102 to provide power control.

As shown in FIG. 11A, the RF system 500 further includes the poweramplifier output tuning control circuit 107, which generates tuningcontrol signals TUNE₁, TUNE₂ . . . TUNE_(m) based on the antenna patternconfiguration, which is indicated by the enable signals enable signalsEN₁, EN₂ . . . EN_(m), in this embodiment.

When a particular antenna pattern configuration is selected, theimpedance matching at an output of one or more of the power amplifiers117 a′, 117 b′ . . . 117 m′ can be impacted.

In the illustrated embodiment, each of the power amplifiers includes atunable output impedance circuit. For example, the power amplifier 117a′ includes a tunable output impedance circuit 119 a, the poweramplifier 117 b′ includes a tunable output impedance circuit 119 b, andthe power amplifier 117 m′ includes a tunable output impedance circuit119 m. The tuning control signals TUNE₁, TUNE₂ . . . TUNE_(m) areoperable to tune the tunable output impedance circuits 119 a, 119 b . .. 119 m, respectively, to compensate for a variation in output impedancearising from a particular antenna pattern configuration.

FIG. 11B is a schematic diagram of an RF system 550 with antenna arraymanagement to provide power control and with low noise amplifier inputtuning compensation according to one embodiment. The RF system 550includes an antenna array 102, signal conditioning circuits 115 a″, 115b″ . . . 115 m″, an antenna array management circuit 106, and an LNAinput tuning control circuit 108.

Although an embodiment with three antenna elements and correspondingsignal conditioning circuits is shown, an RF system can more or fewerantenna elements and/or signal conditioning circuits as indicated by theellipses.

In the embodiment shown in FIG. 11B, each of the signal conditioningcircuits includes a power amplifier and an LNA. For example, the signalconditioning circuit 115 a″ includes a power amplifier 117 a and an LNA118 a′, the signal conditioning circuit 115 b″ includes a poweramplifier 117 b and an LNA 118 b′, and the signal conditioning circuit115 m″ includes a power amplifier 117 m and an LNA 118 m′.

Although an example of signal conditioning circuits with poweramplifiers and LNAs is shown, other implementations of signalconditioning circuits are possible. For example, a signal conditioningcircuit can include additional circuitry, including, for example,switches, phase shifters, duplexers, diplexers, and/or other components.

As shown in FIG. 11B, the antenna array management circuit 106 generatesenable signals EN₁, EN₂ . . . EN_(m) for individually controlling thesignal conditioning circuits 115 a″, 115 b″ . . . 115 m″, respectively.The enable signals EN₁, EN₂ . . . EN_(m) are used to select a particularantenna pattern configuration to provide power control.

As shown in FIG. 11B, the RF system 550 further includes the LNA inputtuning control circuit 108, which generates tuning control signalsTUNE₁, TUNE₂ . . . TUNE_(m) based on the antenna pattern configuration,which is indicated by the enable signals enable signals EN₁, EN₂ . . .EN_(m), in this embodiment.

When a particular antenna pattern configuration is selected, theimpedance matching at an input of one or more of the LNAs 118 a′, 118 b′. . . 118 m′ can be impacted.

In the illustrated embodiment, each of the LNAs includes a tunable inputimpedance circuit. For example, the LNA 118 a′ includes a tunable inputimpedance circuit 121 a, the LNA 118 b′ includes a tunable inputimpedance circuit 121 b, and the LNA 118 m′ includes a tunable inputimpedance circuit 121 m. The tuning control signals TUNE₁, TUNE₂ . . .TUNE_(m) are operable to tune the tunable input impedance circuits 121a, 121 b . . . 121 m, respectively, to compensate for a variation ininput impedance arising from a particular antenna pattern configuration.

An RF system can provide compensation for EM coupling in a wide varietyof ways including, but not limited to, using one or more of thecompensation schemes described herein. For example, an RF system canprovide compensation using the compensation schemes of FIG. 10A, FIG.10B, FIG. 11A, and/or FIG. 11B.

FIG. 12A is graph of simulated beam pattern of a four by four (4×4)array of antenna elements for one scan angle for one example of anantenna pattern configuration with sixteen active antenna elements.

FIG. 12B is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with fourteen active antenna elements.

FIG. 12C is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with twelve active antenna elements.

FIG. 12D is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with twelve active antenna elements.

FIG. 12E is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with ten active antenna elements.

FIG. 12F is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with nine active antenna elements.

FIG. 12G is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12H is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12I is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12J is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with eight active antenna elements.

FIG. 12K is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with seven active antenna elements.

FIG. 12L is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with six active antenna elements.

FIG. 12M is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for another example of an antenna patternconfiguration with six active antenna elements.

FIG. 12N is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with five active antenna elements.

FIG. 12O is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with four active antenna elements.

FIG. 12P is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with three active antenna elements.

FIG. 12Q is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with two active antenna elements.

FIG. 12R is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with one active antenna elements.

The graphs shown in FIGS. 12A-12R depict simulated beam pattern foreighteen antenna pattern configurations of a 4×4 antenna array. However,the teachings herein are applicable to other antenna patternconfigurations as well as to other array sizes and/or shapes. In thisexample, the antenna pattern configurations were selected to provide atleast some symmetry about a center point of the antenna pattern.

The simulations were performed for one example of an antenna model inwhich each antenna element has a peak gain of about 5.7 dB, a lateralgain of about −6.3 dB, an efficiency of about 61.4%, a 3 dB beamwidth ofabout 84 degrees (°), and a 10 dB beamwidth of about 153°. Thesimulations in FIGS. 12A-12R were performed for a scan angle of about 0°with respect to the x-axis and about 0° with respect to the y-axis.Thus, the beam points substantially along the z-axis, in this example.

For each simulated antenna pattern configuration, each antenna elementis graphically depicted with a fill to indicate whether a particularantenna element is in an activated or ON state or in a deactivated orOFF state. The graphs have also been annotated to show the simulatedinput power, peak antenna gain, and EIRP for the particular simulatedantenna pattern configuration. In the simulations, a length of the lobe(relative to the origin of the graph) is an indication of the electricfield strength of the beam.

Table 1 below depicts a summary of simulation results associated withthe graphs of FIGS. 12A-12R.

TABLE 1 Number EIRP Delta 3 dB 10 dB of Active Power Power Peak at EIRPdB Beamwidth Beamwidth Antenna Antenna Input Input Ant Peak below atwidest at widest Elements Pattern mW dB Gain dB dBm max pt pt 16 FIG.12A 16 12.04 17.72 29.76 0.00 25.5° 45.5° 14 FIG. 12B 14 11.46 17.1428.60 −1.16 31.0° 55.5° 12 FIG. 12C 12 10.79 16.47 27.26 −2.50 29.0°51.5° 12 FIG. 12D 12 10.79 16.47 27.26 −2.50 33.0° 57.5° 10 FIG. 12E 1010.00 15.68 25.68 −4.08 34.0° 60.0° 9 FIG. 12F 9 9.54 15.22 24.77 −4.9933.5° 61.0° 8 FIG. 12G 8 9.03 14.71 23.74 −6.02 39.0° 71.5° 8 FIG. 12H 89.03 14.71 23.74 −6.02 48.5° 87.5° 8 FIG. 12I 8 9.03 14.71 23.74 −6.0231.5° 56.5° 8 FIG. 12J 8 9.03 14.71 23.74 −6.02 42.0° 74.5° 7 FIG. 12K 78.45 14.13 22.58 −7.18 47.0° 86.5° 6 FIG. 12L 6 7.78 13.46 21.24 −8.5244.0° 79.5° 6 FIG. 12M 6 7.78 13.46 21.24 −8.52 48.5° 87.5° 5 FIG. 12N 56.99 12.67 19.66 −10.10 42.0° 79.0° 4 FIG. 12O 4 6.02 11.70 17.72 −12.0449.5° 92.5° 3 FIG. 12P 3 4.77 10.45 15.22 −14.54 84.0° 153.0° 2 FIG. 12Q2 3.01 8.69 11.70 −18.06 84.0° 153.0° 1 FIG. 12R 1 0.00 5.68 5.68 −24.0884.0° 153.0°

FIG. 13A is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with sixteen active antenna elements.

FIG. 13B is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with fourteen active antenna elements.

FIG. 13C is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with twelve active antenna elements.

FIG. 13D is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with twelve active antenna elements.

FIG. 13E is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with ten active antenna elements.

FIG. 13F is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with nine active antenna elements.

FIG. 13G is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with eight active antenna elements.

FIG. 13H is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with eight active antenna elements.

FIG. 13I is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with eight active antenna elements.

FIG. 13J is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with eight active antenna elements.

FIG. 13K is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with seven active antenna elements.

FIG. 13L is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with six active antenna elements.

FIG. 13M is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for another example of an antennapattern configuration with six active antenna elements.

FIG. 13N is graph of simulated beam pattern of a 4×4 array of antennaelements for one scan angle for one example of an antenna patternconfiguration with five active antenna elements.

FIG. 13O is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with four active antenna elements.

FIG. 13P is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with three active antenna elements.

FIG. 13Q is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with two active antenna elements.

FIG. 13R is graph of simulated beam pattern of a 4×4 array of antennaelements for another scan angle for one example of an antenna patternconfiguration with one active antenna elements.

With reference to FIGS. 13A-13R, each antenna element is graphicallydepicted with a fill to indicate whether a particular antenna element isin an activated or ON state or in a deactivated or OFF state. The graphshave also been annotated to show the scan angle for the particularsimulated antenna pattern configuration. For FIGS. 13A-13O, thesimulations correspond to a scan angle of about −30° with respect to thex-axis and about −30° with respect to the y-axis. Additionally, forFIGS. 13P and 13Q, the simulations correspond to a scan angle of about−30° with respect to the x-axis and about 0° with respect to the y-axis.Furthermore, for FIG. 13R, the simulations correspond to a scan angle ofabout 0° with respect to the x-axis and about 0° with respect to they-axis.

With reference to FIGS. 12A-13R, the simulation results relate tobeamforming in which antenna pattern configuration provides powercontrol. The simulation results reflect not only conducted power, butalso beamforming gain.

As shown by the simulation results, beamforming can result in both amain lobe of energy as well as one or more side lobes of energy. Incertain implementations, the main lobe is used for wireless signalcommunication. Additionally, an antenna pattern configuration is changedto provide power control, thereby changing a magnitude of the beam withrelatively small impact on main-lobe width, main-lobe pointingdirection, and/or change to side lobes. Thus, power control can beprovided while maintaining robust beam characteristics.

In certain implementations, main beam width becomes more focused as anumber of active antenna elements increases. For example, as the actualpower is increased and the main beam narrows, a magnified increase inEIRP (for instance, an average 2 dB EIRP increase for each 1 dB increasein actual power) is provided, while maintaining the main lobe directionwithin a few degrees.

Although one example of simulation results is shown, simulation resultscan vary based on a wide variety of factors, including, but not limitedto, simulation parameters (including operating frequency), antennamodels, and/or simulation tools.

Examples of Modules and Devices Applicable to Beamforming CommunicationSystems

Beamforming communication systems can be implemented using a widevariety of modules, semiconductor dies, and/or other components.Furthermore, beamforming communications systems can be included a widevariety of devices, including, but not limited to, mobile phones,tablets, base stations, network access points, customer-premisesequipment (CPE), laptops, and wearable electronics. For example,modules, semiconductor dies, and/or other components can be included oncircuit boards used in such devices.

Although various examples of such RF electronics is provided below, theteachings herein are applicable to RF electronics implemented in a widevariety of ways. Accordingly, other implementations are possible.

FIG. 14 is a schematic diagram of one embodiment of a module 680. Themodule 680 includes antenna array(s) 681, a substrate 682, encapsulation683, IC(s) 684, surface mound device(s) or SMD(s) 685, integratedpassive device(s) or IPD(s) 686, and shielding 687. The module 680illustrates various examples of components and structures that can beincluded in a module of a communication device that provides beamcontrol.

Although one example of a combination of components and structures isshown, a module can include more or fewer components and/or structures.

FIG. 15A is a perspective view of another embodiment of a module 700.FIG. 15B is a cross-section of the module 700 of FIG. 15A taken alongthe lines 15B-15B.

The module 700 includes a laminated substrate or laminate 701, asemiconductor die or IC 702 (not visible in FIG. 15A), SMDs (not visiblein FIG. 15A), and an antenna array including antenna elements 710 a 1,710 a 2, 710 a 3 . . . 710 an, 710 b 1, 710 b 2, 710 b 3 . . . 710 bn,710 c 1, 710 c 2, 710 c 3 . . . 710 cn, 710 m 1, 710 m 2, 710 m 3 . . .710 mn.

Although not shown in FIGS. 15A and 15B, the module 700 can includeadditional structures and components that have been omitted from thefigures for clarity. Moreover, the module 700 can be modified or adaptedin a wide variety of ways as desired for a particular application and/orimplementation.

The antenna elements antenna elements 710 a 1, 710 a 2, 710 a 3 . . .710 an, 710 b 1, 710 b 2, 710 b 3 . . . 710 bn, 710 c 1, 710 c 2, 710 c3 . . . 710 cn, 710 m 1, 710 m 2, 710 m 3 . . . 710 mn are formed on afirst surface of the laminate 701, and can be used to receive and/ortransmit signals, based on implementation. Although a 4×4 array ofantenna elements is shown, more or fewer antenna elements are possibleas indicated by ellipses. Moreover, antenna elements can be arrayed inother patterns or configurations, including, for instance, arrays usingnon-uniform arrangements of antenna elements. Furthermore, in anotherembodiment, multiple antenna arrays are provided, such as separateantenna arrays for transmit and receive.

In the illustrated embodiment, the IC 702 is on a second surface of thelaminate 701 opposite the first surface. However, other implementationsare possible. In one example, the IC 702 is integrated internally to thelaminate 701.

In certain implementations, the IC 702 includes signal conditioningcircuits associated with the antenna elements 710 a 1, 710 a 2, 710 a 3. . . 710 an, 710 b 1, 710 b 2, 710 b 3 . . . 710 bn, 710 c 1, 710 c 2,710 c 3 . . . 710 cn, 710 m 1, 710 m 2, 710 m 3 . . . 710 mn, and anantenna array management circuit that achieves a desired level of powercontrol based on generating the control signals for the signalconditioning circuits to select an antenna pattern configurationassociated with a desired power control level. Although animplementation with one semiconductor chip is shown, the teachingsherein are applicable to implementations with additional chips.

The laminate 701 can include various structures including, for example,conductive layers, dielectric layers, and/or solder masks. The number oflayers, layer thicknesses, and materials used to form the layers can beselected based on a wide variety of factors, and can vary withapplication and/or implementation. The laminate 701 can include vias forproviding electrical connections to signal feeds and/or ground feeds ofthe antenna elements. For example, in certain implementations, vias canaid in providing electrical connections between signal conditioningcircuits of the IC 702 and corresponding antenna elements.

The antenna elements 710 a 1, 710 a 2, 710 a 3 . . . 710 an, 710 b 1,710 b 2, 710 b 3 . . . 710 bn, 710 c 1, 710 c 2, 710 c 3 . . . 710 cn,710 m 1, 710 m 2, 710 m 3 . . . 710 mn can correspond to antennaelements implemented in a wide variety of ways. In one example, thearray of antenna elements includes patch antenna element formed from apatterned conductive layer on the first side of the laminate 701, with aground plane formed using a conductive layer on opposing side of thelaminate 701 or internal to the laminate 701. Other examples of antennaelements include, but are not limited to, dipole antenna elements,ceramic resonators, stamped metal antennas, and/or laser directstructuring antennas.

FIG. 16 is a schematic diagram of one embodiment of a mobile device 800.The mobile device 800 includes a baseband system 801, a sub millimeterwave (mmW) transceiver 802, a sub mmW front end system 803, sub mmWantennas 804, a power management system 805, a memory 806, a userinterface 807, a mmW baseband (BB)/intermediate frequency (IF)transceiver 812, a mmW front end system 813, and mmW antennas 814.

The mobile device 800 can be used communicate using a wide variety ofcommunications technologies, including, but not limited to, 2G, 3G, 4G(including LTE, LTE-Advanced, and LTE-Advanced Pro), 5G NR, WLAN (forinstance, WiFi), WPAN (for instance, Bluetooth and ZigBee), WMAN (forinstance, WiMax), and/or GPS technologies.

In the illustrated embodiment, the sub mmW transceiver 802, sub mmWfront end system 803, and sub mmW antennas 804 serve to transmit andreceive centimeter waves and other radio frequency signals belowmillimeter wave frequencies. Additionally, the mmW BB/IF transceiver812, mmW front end system 813, and mmW antennas 814 serve to transmitand receive millimeter waves. Although one specific example is shown,other implementations are possible, including, but not limited to,mobile devices operating using circuitry operating over differentfrequency ranges and wavelengths.

The sub mmW transceiver 802 generates RF signals for transmission andprocesses incoming RF signals received from the sub mmW antennas 804. Itwill be understood that various functionalities associated with thetransmission and receiving of RF signals can be achieved by one or morecomponents that are collectively represented in FIG. 16 as the sub mmWtransceiver 802. In one example, separate components (for instance,separate circuits or dies) can be provided for handling certain types ofRF signals.

The sub mmW front end system 803 aids is conditioning signalstransmitted to and/or received from the antennas 804. In the illustratedembodiment, the front end system 803 includes power amplifiers (PAs)821, low noise amplifiers (LNAs) 822, filters 823, switches 824, andsignal splitting/combining circuitry 825. However, other implementationsare possible.

For example, the sub mmW front end system 803 can provide a number offunctionalizes, including, but not limited to, amplifying signals fortransmission, amplifying received signals, filtering signals, switchingbetween different bands, switching between different power modes,switching between transmission and receiving modes, duplexing ofsignals, multiplexing of signals (for instance, diplexing ortriplexing), or some combination thereof.

In certain implementations, the mobile device 800 supports carrieraggregation, thereby providing flexibility to increase peak data rates.Carrier aggregation can be used for both Frequency Division Duplexing(FDD) and Time Division Duplexing (TDD), and may be used to aggregate aplurality of carriers or channels. Carrier aggregation includescontiguous aggregation, in which contiguous carriers within the sameoperating frequency band are aggregated. Carrier aggregation can also benon-contiguous, and can include carriers separated in frequency within acommon band or in different bands.

The sub mmW antennas 804 can include antennas used for a wide variety oftypes of communications. For example, the sub mmW antennas 804 caninclude antennas for transmitting and/or receiving signals associatedwith a wide variety of frequencies and communications standards.

The mmW BB/IF transceiver 812 generates millimeter wave signals fortransmission and processes incoming millimeter wave signals receivedfrom the mmW antennas 814. It will be understood that variousfunctionalities associated with the transmission and receiving of RFsignals can be achieved by one or more components that are collectivelyrepresented in FIG. 16 as the mmW transceiver 812. The mmW BB/IFtransceiver 812 can operate at baseband or intermediate frequency, basedon implementation.

The mmW front end system 813 aids is conditioning signals transmitted toand/or received from the mmW antennas 814. In the illustratedembodiment, the front end system 803 includes power amplifiers 831, lownoise amplifiers 832, switches 833, up converters 834, down converters835, and phase shifters 836. However, other implementations arepossible. In one example, the mobile device 800 operates with a BB mmWtransceiver, and up converters and downconverters are omitted from themmW front end system. In another example, the mmW front end systemfurther includes filters for filtering millimeter wave signals.

The mmW antennas 814 can include antennas used for a wide variety oftypes of communications. The mmW antennas 814 can include antennaelements implemented in a wide variety of ways, and in certainconfigurations the antenna elements are arranged to form one or moreantenna arrays. Examples of antenna elements for millimeter wave antennaarrays include, but are not limited to, patch antennas, dipole antennaelements, ceramic resonators, stamped metal antennas, and/or laserdirect structuring antennas.

In certain implementations, the mobile device 800 supports MIMOcommunications and/or switched diversity communications. For example,MIMO communications use multiple antennas for communicating multipledata streams over a single radio frequency channel. MIMO communicationsbenefit from higher signal to noise ratio, improved coding, and/orreduced signal interference due to spatial multiplexing differences ofthe radio environment. Switched diversity refers to communications inwhich a particular antenna is selected for operation at a particulartime. For example, a switch can be used to select a particular antennafrom a group of antennas based on a variety of factors, such as anobserved bit error rate and/or a signal strength indicator.

In certain implementations, the mobile device 800 operates withbeamforming. For example, the mmW front end system 803 includesamplifiers having controllable gain and phase shifters havingcontrollable phase to provide beam formation and directivity fortransmission and/or reception of signals using the mmW antennas 814. Forexample, in the context of signal transmission, the amplitude and phasesof the transmit signals provided to an antenna array used fortransmission are controlled such that radiated signals combine usingconstructive and destructive interference to generate an aggregatetransmit signal exhibiting beam-like qualities with more signal strengthpropagating in a given direction. In the context of signal reception,the amplitude and phases are controlled such that more signal energy isreceived when the signal is arriving to the antenna array from aparticular direction.

The baseband system 801 is coupled to the user interface 807 tofacilitate processing of various user input and output (I/O), such asvoice and data. The baseband system 801 provides the sub mmW and mmWtransceivers with digital representations of transmit signals, which areprocessed by the transceivers to generate RF signals for transmission.The baseband system 801 also processes digital representations ofreceived signals provided by the transceivers. As shown in FIG. 16, thebaseband system 801 is coupled to the memory 806 of facilitate operationof the mobile device 800.

The memory 806 can be used for a wide variety of purposes, such asstoring data and/or instructions to facilitate the operation of themobile device 800 and/or to provide storage of user information.

The power management system 805 provides a number of power managementfunctions of the mobile device 800. In certain implementations, thepower management system 805 includes a PA supply control circuit thatcontrols the supply voltages of the power amplifiers of the front endsystems. For example, the power management system 805 can be configuredto change the supply voltage(s) provided to one or more of the poweramplifiers to improve efficiency, such as power added efficiency (PAE).

In certain implementations, the power management system 805 receives abattery voltage from a battery. The battery can be any suitable batteryfor use in the mobile device 800, including, for example, a lithium-ionbattery.

FIG. 17A is a schematic diagram of another embodiment of a module 900.FIG. 17B is a schematic diagram of a cross-section of the module 900 ofFIG. 17A taken along the lines 17B-17B.

The module 900 includes radio frequency components 901, a semiconductordie 902, surface mount devices 903, wirebonds 908, a package substrate920, and an encapsulation structure 940. The package substrate 920includes pads 906 formed from conductors disposed therein. Additionally,the semiconductor die 902 includes pins or pads 904, and the wirebonds908 have been used to connect the pads 904 of the die 902 to the pads906 of the package substrate 920.

In certain implementations, the semiconductor die 902 includes signalconditioning circuits associated with antenna elements of an antennaarray, and an antenna array management circuit that achieves a desiredlevel of power control based on generating the control signals for thesignal conditioning circuits to select an antenna pattern configurationassociated with a desired power control level. Although animplementation with one semiconductor chip is shown, the teachingsherein are applicable to implementations with additional chips.

The packaging substrate 920 can be configured to receive a plurality ofcomponents such as radio frequency components 901, the semiconductor die902 and the surface mount devices 903, which can include, for example,surface mount capacitors and/or inductors. In one implementation, theradio frequency components 901 include integrated passive devices(IPDs).

As shown in FIG. 17B, the module 900 is shown to include a plurality ofcontact pads 932 disposed on the side of the module 900 opposite theside used to mount the semiconductor die 902. Configuring the module 900in this manner can aid in connecting the module 900 to a circuit board,such as a phone board of a mobile device. The example contact pads 932can be configured to provide radio frequency signals, bias signals,and/or power (for example, a power supply voltage and ground) to thesemiconductor die 902 and/or other components. As shown in FIG. 17B, theelectrical connections between the contact pads 932 and thesemiconductor die 902 can be facilitated by connections 933 through thepackage substrate 920. The connections 933 can represent electricalpaths formed through the package substrate 920, such as connectionsassociated with vias and conductors of a multilayer laminated packagesubstrate.

In some embodiments, the module 900 can also include one or morepackaging structures to, for example, provide protection and/orfacilitate handling. Such a packaging structure can include overmold orencapsulation structure 940 formed over the packaging substrate 920 andthe components and die(s) disposed thereon.

It will be understood that although the module 900 is described in thecontext of electrical connections based on wirebonds, one or morefeatures of the present disclosure can also be implemented in otherpackaging configurations, including, for example, flip-chipconfigurations.

FIG. 18A is a schematic diagram of a cross-section of another embodimentof a module 950. The module 950 includes a laminated package substrate951 and a flip-chip semiconductor die 952.

The laminated package substrate 951 includes a cavity-based antenna 958associated with an air cavity 960, a first conductor 961, a secondconductor 962. The laminated package substrate 951 further includes aplanar antenna 959.

In certain implementations herein, a module includes one or moreintegrated antennas. For example, the module 950 of FIG. 18A includesthe cavity-based antenna 958 and the planar antenna 959. By includingantennas facing in multiple directions (including, but not limited to,directions that are substantially perpendicular to one another), a rangeof available angles for communications can be increased. Although oneexample of a module with integrated antennas is shown, the teachingsherein are applicable to modules implemented in a wide variety of ways.

In certain implementations, the semiconductor die 952 includes signalconditioning circuits associated with antenna elements of an antennaarray, and an antenna array management circuit that achieves a desiredlevel of power control based on generating the control signals for thesignal conditioning circuits to select an antenna pattern configurationassociated with a desired power control level. Although animplementation with one semiconductor chip is shown, the teachingsherein are applicable to implementations with additional chips.

FIG. 18B is a perspective view of another embodiment of a module 1020.The module 1020 includes a laminated substrate 1010 and a semiconductordie 1012. The semiconductor die 1012 includes at least one of a frontend system 945 or a transceiver 946. For example, the front end system945 can include signal conditioning circuits, such as controllableamplifiers and/or controllable phase shifters, to aid in providingbeamforming.

In the illustrated the embodiment, cavity-based antennas 1011 a-1011 phave been formed on an edge 1022 of the laminated substrate 1010. Inthis example, sixteen cavity-based antennas have been provided in afour-by-four (4×4) array. However, more or fewer antennas can beincluded and/or antennas can be arrayed in other patterns.

In another embodiment, the laminated substrate 1010 further includeanother antenna array (for example, a patch antenna array) formed on asecond major surface of the laminated substrate 1010 opposite the firstmajor surface 1021. Implementing the module 1020 aids in increasing arange of angles over which the module 1020 can communicate.

The module 1020 illustrates another embodiment of a module including anarray of antennas that are controllable to provide beamforming.Implementing an array of antennas on a side of module aids incommunicating at certain angles and/or directions that may otherwise beunavailable due to environmental blockage. Although an example withcavity-based antennas is shown, the teachings herein are applicable toimplementations using other types of antennas.

Applications

The principles and advantages of the embodiments described herein can beused for a wide variety of applications.

For example, dynamically managed antenna arrays can be included invarious electronic devices, including, but not limited to consumerelectronic products, parts of the consumer electronic products,electronic test equipment, etc. Example electronic devices include, butare not limited to, a base station, a wireless network access point, amobile phone (for instance, a smartphone), a tablet, a television, acomputer monitor, a computer, a hand-held computer, a personal digitalassistant (PDA), a microwave, a refrigerator, an automobile, a stereosystem, a disc player, a digital camera, a portable memory chip, awasher, a dryer, a copier, a facsimile machine, a scanner, amulti-functional peripheral device, a wrist watch, a clock, etc.Further, the electronic devices can include unfinished products.

CONCLUSION

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Likewise, the word “connected”, as generally used herein, refers to twoor more elements that may be either directly connected, or connected byway of one or more intermediate elements. Additionally, the words“herein,” “above,” “below,” and words of similar import, when used inthis application, shall refer to this application as a whole and not toany particular portions of this application. Where the context permits,words in the above Detailed Description using the singular or pluralnumber may also include the plural or singular number respectively. Theword “or” in reference to a list of two or more items, that word coversall of the following interpretations of the word: any of the items inthe list, all of the items in the list, and any combination of the itemsin the list.

Moreover, conditional language used herein, such as, among others,“may,” “could,” “might,” “can,” “e.g.,” “for example,” “such as” and thelike, unless specifically stated otherwise, or otherwise understoodwithin the context as used, is generally intended to convey that certainembodiments include, while other embodiments do not include, certainfeatures, elements and/or states. Thus, such conditional language is notgenerally intended to imply that features, elements and/or states are inany way required for one or more embodiments or that one or moreembodiments necessarily include logic for deciding, with or withoutauthor input or prompting, whether these features, elements and/orstates are included or are to be performed in any particular embodiment.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A beamforming communication system comprising: anantenna array management circuit configured to generate a plurality ofenable signals to operate a plurality of antenna elements in at leastfirst and second antenna pattern configurations that change antenna gaintowards a base station, the first antenna pattern configuration having afirst electromagnetic coupling among the plurality of antenna elements,and the second antenna pattern having a second electromagnetic couplingamong the plurality of antenna elements; and a power amplifier outputtuning control circuit configured to tune an output impedance of aplurality of power amplifiers based at least on the first and secondplurality of enable signals to compensate for the first and secondelectromagnetic couplings of the first and second antenna patternconfigurations.
 2. The beamforming communication system of claim 1wherein the plurality of enable signals are each operable to set acorresponding signal conditioning circuit in an on state or an offstate.
 3. The beamforming communication system of claim 1 wherein theplurality of enable signals are each operable to set a correspondingsignal conditioning circuit in an on state, an off state, or anattenuated state, the attenuated state providing a portion of a gainprovided by the on state.
 4. The beamforming communication system ofclaim 1 further comprising a dual polarization antenna array, the firstantenna pattern configuration provides a first antenna polarization, andthe second antenna pattern configuration provides a second power levelfor a second polarization.
 5. The beamforming communication system ofclaim 1 wherein a plurality of antenna pattern configurations providedifferent steps of effective isotropic radiated power.
 6. Thebeamforming communication system of claim 1 wherein the first and secondantenna pattern configurations are configured for wireless reception,the first and second antenna pattern configurations providing differentvalues of effective isotropic sensitivity.
 7. The beamformingcommunication system of claim 1 further comprising a plurality ofantenna termination circuits each connected to a corresponding one of aplurality of antenna elements, the antenna array management circuitfurther configured to control the plurality of antenna terminationcircuits based on the first and second antenna pattern configurations.8. The beamforming communication system of claim 1 further comprising afront end integrated circuit including at least one front end componentconnected along a signal path to the first and second plurality ofantenna elements, and a memory circuit programmed with data operable tocontrol one or more settings of the at least one front end component. 9.The beamforming communication system of claim 8 wherein the data of thememory circuit provides compensation for the first and secondelectromagnetic couplings associated with the first and second antennapattern configurations.
 10. The beamforming communication system ofclaim 1 wherein compensation for digital pre-distortion is based atleast in part a selected one of the first and second antenna patternconfigurations.
 11. A radio frequency module for a beamformingcommunication system, the radio frequency module comprising: asemiconductor die attached to a substrate, the semiconductor dieincluding an antenna array management circuit configured to generate aplurality of enable signals operate a first plurality of antennaelements in at least first and second antenna pattern configurationsthat change antenna gain towards a base station, the first antennapattern configuration having first electromagnetic coupling among theplurality of antenna elements, and the second antenna pattern havingsecond electromagnetic coupling among the plurality of antenna elements,the semiconductor die further including a power amplifier output tuningcontrol circuit configured to tune an output impedance of a plurality ofpower amplifiers based at least one the first and second plurality ofenable signals to compensate for the first and second electromagneticcouplings of the first and second antenna pattern configurations. 12.The radio frequency module of claim 11 wherein the first plurality ofenable signals are each operable to set a corresponding signalconditioning circuit in an on state or an off state.
 13. The radiofrequency module of claim 11 wherein the first plurality of enablesignals are each operable to set a corresponding signal conditioningcircuit in an on state, an off state, or an attenuated state, theattenuated state providing a portion of a gain provided by the on state.14. The radio frequency module of claim 11 further comprising is a dualpolarization antenna array, the first antenna pattern configurationprovides a first power level for a first antenna polarization, and thesecond antenna pattern configuration provides a second power level for asecond polarization.
 15. The radio frequency module of claim 11 whereina plurality of antenna pattern configurations provide different steps ofeffective isotropic radiated power.
 16. The radio frequency module ofclaim 11 wherein the first and second antenna pattern configurations areconfigured for wireless reception, the first and second antenna patternconfigurations providing different values of effective isotropicsensitivity.
 17. The radio frequency module of claim 11 furthercomprising a plurality of antenna termination circuits each connected toa corresponding one of a plurality of antenna elements, the antennaarray management circuit further configured to control the plurality ofantenna termination circuits based on the first and second antennapattern configurations.
 18. The radio frequency module of claim 11further comprising a front end integrated circuit including at least onefront end component connected along a signal path to the first andsecond plurality of antenna elements, and a memory circuit programmedwith data operable to control one or more settings of the at least onefront end component.
 19. The radio frequency module of claim 18 whereinthe data of the memory circuit provides compensation for the first andsecond electromagnetic couplings associated with the first and secondantenna pattern configurations.
 20. The radio frequency module of claim11 wherein compensation for digital pre-distortion is based at least inpart on a selected one of the first and second antenna patternconfigurations.